USM – HP FORGE STRATEGIC PARTNERSHIP TO DRIVE FUTURE TECHNOLOGY AND ENGINEERING TALENT
USM PENANG, 19 May 2026 – Universiti Sains Malaysia (USM) has taken another step forward in strengthening the higher education–industry ecosystem by signing a Memorandum of Understanding (MoU) with HP Malaysia Manufacturing Sdn. Bhd. (HPMM).
This strategic partnership is set to open a new chapter in developing Malaysia’s future technology and engineering talent.
The MoU marks a key milestone in enhancing academic–industry collaboration through high-impact initiatives in talent development, industry-based learning, and future technology advancement.
USM Vice-Chancellor, Professor Dato’ Seri Ir. Dr. Abdul Rahman Mohamed, said the partnership creates a strategic framework between academia and industry that will greatly benefit the engineering community, especially the School of Electrical and Electronic Engineering.
He explained that the collaboration will be strengthened through the implementation of the Industry-Infused Incubator (MRI3) and Industry-Infused Programme (IIP), designed to produce graduates who are intellectual, balanced, and competent in real-world work environments.
“This platform will provide impactful industrial training, industry-supported final year projects, and real workplace experiences that enhance student employability,” he said
Abdul Rahman added that integrating HP Malaysia’s expertise into USM’s ‘Industry in Campus’ ecosystem will bridge the gap between academic knowledge and industrial practice.
“Students will gain direct exposure to high-tech manufacturing, Industry 4.0 applications, robotics, and automation, ensuring they are fully prepared to meet current industry demands,” he emphasised.
At the same event, Managing Director of HP Malaysia Manufacturing Sdn. Bhd., Dominic Chew, said that the MoU is more than a formal agreement; it reflects mutual trust in the power of collaboration between industry and academia to shape future talent, accelerate innovation, and strengthen Malaysia’s high-tech manufacturing ecosystem.
He noted that HP Malaysia Manufacturing, based in Batu Kawan, is one of HP’s key global facilities producing inkjet printheads, supported by Industry 4.0 capabilities including automation, data analytics, and digital manufacturing systems.
“This collaboration covers key areas such as industry exposure and site visits, internship and career opportunities, final year and Capstone projects, support for STEAM initiatives like ROBOCON, and skills enhancement programmes aligned with Industry 4.0,” Chew explained.
He added that HP views the partnership as a long-term investment not only in students but also in the future of Malaysia’s engineering capabilities.
“The combination of USM’s academic strength and research excellence with HP’s industry expertise and global perspective will produce a new generation of competitive technology talent ready to face future challenges,” he said.
The ceremony concluded with a contribution of RM10,000.00 from HP Malaysia Manufacturing to the ROBOCON USM team, comprising students from the School of Electrical and Electronic Engineering.
This gesture underscores the company’s commitment to nurturing student talent and advancing technological innovation, particularly in strengthening the team’s preparations for the upcoming National Robot Contest (ROBOCON).
Also present at the ceremony were Tuanku Syed Sirajuddin Engineering Campus Director, Professor Ir. Dr. Mariatti Jaafar @ Mustapha; HP Malaysia Manufacturing Engineering Director, Lee Nget Ham; Chief of Staff and Strategic Planning Manager, Ng Kok Seong; and Associate Professor Dr. Muhammad Nasiruddin Mahyuddin, representing the Dean of the School of Electrical and Electronic Engineering.
Original Text: Mohd Azrul Mohd Azhar/Translation: Tan Ewe Hoe/Photo: Mohd Fairus Md Isa
Source: USM News Portal