Dr. Noor Dzulaikha Daud

Last Updated On 26.011.2025
PhD in Electrical Engineering
Universiti Teknologi Malaysia (UTM)
M. Eng in Electrical Power Engineering
Universiti Teknologi Malaysia (UTM)
B. Eng (Hons). in Electrical Systems Engineering
Universiti Malaysia Perlis (UniMAP)
Tel : +604 5996080
Fax : +604 5996909
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Researcher Identifiers
Researcher ID : ETU-0401-2022
ORCID : 0009-0009-6851-1134
Scopus Author ID: 57196075215
Google Scholar ID: wfpqursAAAAJ
USM Expertise Link : https://experts.usm.my/cvitae/ndzulaikha
Last Updated On 14/03/2025
a) Discharge Machining
b) Finite Element Analysis
c) Electrical Power Engineering
a) Micromachining
b) Renewable Energy
- Hariri, M. H. M., Daud, N. D., Sutikno, T., Yusoff, N. A. M., & Desa, M. K. M. (2025). Dead time control signal for non-isolated synchronous buck DC-DC converter.Int J Pow Elec & Dri Syst,16(3), 1765-1774.
- Hariri, M. H. M., Daud, N. D., Yusoff, N. A. M., Zaman, S. M. Z. S., & Desa, M. K. M. (2025). A comparative analysis of hybrid of traditional load flow methods for IEEE distributed power generation networks.Indonesian Journal of Electrical Engineering and Computer Science,39(1), 33-44.
- Daud, N. D., Suhaimi, N. L., & Mohd Jamil, M. K. (2025). Surface Discharge Detection with Ultra High Frequency Loop Antenna Sensor.International Journal on Electrical Engineering & Informatics,17(2).
- Daud, N. D., Hasan, M. N., Saleh, T., Leow, P. L., & Mohamed Ali, M. S. (2022). Non-traditional machining techniques for silicon wafers.The International Journal of Advanced Manufacturing Technology,121(1), 29-57.
- Daud, N. D., Hasan, M. N., & Ali, M. S. M. (2021). Microelectrical discharge machining of silicon wafers. InMicro Electro-Fabrication(pp. 219-244). Elsevier.
- Daud, N. D., Mohd Ghazali, F. A., Abd Hamid, F. K., Nafea, M., Saleh, T., Leow, P. L., & Mohamed Ali, M. S. (2021). Heat-assisted μ-electrical discharge machining of silicon.The International Journal of Advanced Manufacturing Technology,113(5), 1727-1738.
- Daud, N. D., Nafea, M., & Ali, M. S. M. (2021). Finite element analysis of material removal rate for Si wafer using Heat-assisted µEDM.ELEKTRIKA-Journal of Electrical Engineering,20(2-2), 15-19.
- Daud, N. D., AbuZaiter, A., Leow, P. L., & Mohamed Ali, M. S. (2018). The effects of the silicon wafer resistivity on the performance of microelectrical discharge machining.The International Journal of Advanced Manufacturing Technology,95(1), 257-266.
Last Updated on 26/11/2025